韌體工程師 (Android BSP Engineer)

最近更新於 2021-09-25

工作內容

1. Responsible for system bring up under Android
2. Collaborate with hardware design to complete functional module-driven development
3. Responsible for Android framework development and customization
4. Responsible for driver porting or debugging

條件要求

1. Experience with Android framework development and customization
2. Excellent C/C++/Java coding skills
3. Experience with new hardware bring-up and factory manufacturing
4. Familiarity with one or more of the following Android sub-systems: multimedia/camera/display/network/Wi-Fi
5. Experiences with Linux kernel or driver debugging
6. Ability to quickly ramp-up on complex and unfamiliar code

遠端型態

完全遠端面試

此職缺面試流程採線上面談,無實體會談

部分遠端工作

目前公司執行全員遠端工作至6/14,僅報到當日進辦公室;疫情緩和後仍須進辦公室工作。

員工福利

法定項目

勞保、健保、特別休假、勞退、婚假

其他福利

1.員工分紅/營運績效獎金
2.彈性上下班/人性化管理
3.暢通的晉升與轉職制度
4.四節、生日、婚喪喜慶等禮金及禮券補助
5.福委會國內外旅遊補助
6.定期健康檢查
7.完善員工保險福利措施
8.優於勞基法的休假制度

薪資範圍

面議(經常性薪資達4萬元)